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Showing items 1-10 of 11 (2 Page(s) Totally)
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| 國立成功大學 |
2005-03-08 |
Formation and morphology of the intermetallic compounds formed at the 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface
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Wang, Moo-Chin; Yu, Shan-Pu; Chang, Tao-Chih; Hon, Min-Hsiung |
| 國立成功大學 |
2004-11-03 |
Kinetics of intermetallic compound formation at 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface
|
Wang, Moo-Chin; Yu, Shan-Pu; Chang, Tao-Chih; Hon, Min-Hsiung |
| 國立成功大學 |
2002-01 |
Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate
|
Yu, Shan-Pu; Wang, Hsin-Chien; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2001-09 |
Effect of process parameters on the properties of alumina-zirconia-graphite (AZG) refractories (part 2) - Baking temperature and time
|
Yu, Shan-Pu; Yang, Ko-Ho; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2001-07 |
Effect of process parameters on the properties of alumina-zirconia-graphite refractories (Part 1) - Forming pressure and baking temperature
|
Yu, Shan-Pu; Yang, Ko-Ho; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2001-01 |
Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface
|
Yu, Shan-Pu; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2000-09 |
The effects of flux on the wetting characteristics of near-eutectic Sn-Zn-In solder on Cu substrate
|
Yu, Shan-Pu; Liao, Cheng-Lung; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2000-08 |
Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate
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Yu, Shan-Pu; Lin, H. J.; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2000-08 |
Properties of alumina-zirconia-graphite refractories with particle size according to the Andreasen model
|
Yu, Shan-Pu; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2000-06 |
Composition and heat-treatment effects on the adhesion strength of Sn-Zn-Al solders on Cu substrate
|
Yu, Shan-Pu; Hon, Min-Hsiung; Wang, Hsin-Chien; Wang, Moo-Chin |
Showing items 1-10 of 11 (2 Page(s) Totally)
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